Concepedia

Paul Mescher

PM

2

Publications

25

Citations

2

H-Index

2003

Active since

Affiliations

Amkor Technology (United States)(Current)

Paul Mescher is an author at Amkor Technology (United States) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringCorrosionReliabilityMicrostructureMaterial ScienceMicrofabrication

Publications per year

2003–2018

2

Publications

2

The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages

Richard Coyle, A. Holliday, Paul Mescher et al. · 2003 · 14 citations

Brittle Fractures, Engineering, Mechanical Engineering +18

Board Level Reliability Study of Next Generation Large Die Wafer Level Chip Scale Package Structures

Timo Henttonen, Paul Mescher, Doug Scott et al. · 2018 · 11 citations

Reliability, Electrical Engineering, Reliability Engineering +14

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