Concepedia

Manabu Tsujimura

MT

Statistics

Publications

7

Citations

170

H-Index

7

Active since

2001

Affiliations

Ebara (Japan)(Current)

Toshiba (Japan)

Manabu Tsujimura is an author at Ebara (Japan) specializing in materials engineering, semiconductor devices, and materials science.

Publications per year

2001–2019

7

Publications

7

Eutectic Sn-Ag solder bump process for ULSI flip chip technology

H. Ezawa, Masahiro Miyata, S. Honma et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 38 citations

Engineering, Materials Engineering, Materials Science +14

The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies

Manabu Tsujimura · Japanese Journal of Applied Physics · 2016 · 37 citations

Engineering, Electrical Engineering, Electronic Materials +16

Effects of Liner Metal and CMP Slurry Oxidizer on Copper Galvanic Corrosion

Shohei Shima, Akira Fukunaga, Manabu Tsujimura · ECS Transactions · 2007 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Enhanced Open Innovation: CMP Innovation to Open New Paradigm

Manabu Tsujimura · ECS Journal of Solid State Science and Technology · 2019 · 19 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +10

Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure

Masako Kodera, Shin‐ichiro Uekusa, Hidekazu Nagano et al. · Journal of The Electrochemical Society · 2005 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

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