K. Hieber

Structural and electrical properties of Ta and Ta nitrides deposited by chemical vapour deposition

K. Hieber · Thin Solid Films · 1974 · 105 citations

Materials Science, Boron Nitride, Engineering +7

Three dimensional metallization for vertically integrated circuits

Peter Ramm, D. Bollmann, Rosi Braun et al. · Microelectronic Engineering · 1997 · 90 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +8

Structural and electrical properties of evaporated Cr-Ni films as a function of gas pressure

L. Lassak, K. Hieber · Thin Solid Films · 1973 · 52 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Reduced self-heating in Si/SiGe field-effect transistors on thin virtual substrates prepared by low-energy plasma-enhanced chemical vapor deposition

T. Hackbarth, H.-J. Herzog, K. Hieber et al. · Applied Physics Letters · 2003 · 35 citations

Semiconductor Technology, Electrical Engineering, Engineering +15

Structural changes of evaporated tantalum during film growth

K. Hieber, N.M. Mayer · Thin Solid Films · 1982 · 34 citations

Materials Science, Materials Engineering, Engineering +7