Francesco de Paulis

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 174 citations

Engineering, Physics-based Via, Structural Optimization +22

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Yaojiang Zhang, Jun Fan, G. Selli et al. · IEEE Transactions on Microwave Theory and Techniques · 2008 · 152 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

A Simple and Efficient Design Procedure for Planar Electromagnetic Bandgap Structures on Printed Circuit Boards

Leo Raimondo, Francesco de Paulis, Antonio Orlandi · IEEE Transactions on Electromagnetic Compatibility · 2010 · 73 citations

Electrical Engineering, Engineering, Planar Ebg Structure +13

Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters

Francesco de Paulis, Yaojiang Zhang, Jun Fan · IEEE Transactions on Electromagnetic Compatibility · 2010 · 71 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +17

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

D. Jung, Youngwoo Kim, Jonghoon J. Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 67 citations

Materials Engineering, Silicon Via, Electrical Engineering +15