Concepedia

Brian Grummel

BG

6

Publications

137

Citations

6

H-Index

2008

Active since

Affiliations

GeneSiC Semiconductor (United States)(Current)

University of Central Florida

Wolfspeed, Inc. (United States)

Brian Grummel is an author at GeneSiC Semiconductor (United States) specializing in electrical engineering, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringApplied PhysicsMaterial SciencePower ElectronicsElectronic PackagingPower SemiconductorsNanoelectronicsHigh Voltage Engineering

Publications per year

2008–2015

6

Publications

6

Design consideration of high temperature SiC power modules

Brian Grummel, R. McClure, Lei Zhou et al. · 2008 · 36 citations

Wide-bandgap Semiconductor, Engineering, Power Electronic Systems +19

Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach

Brian Grummel, Z. John Shen, Habib A. Mustain et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 30 citations

Tlp Bonding, Engineering, Mechanical Engineering +18

10 kV SiC BJTs — Static, switching and reliability characteristics

Siddarth Sundaresan, Stoyan Jeliazkov, Brian Grummel et al. · 2013 · 25 citations

Semiconductor Technology, Electrical Engineering, Engineering +12

Short circuit robustness of 1200 V SiC switches

Ranbir Singh, Brian Grummel, Siddarth Sundaresan · 2015 · 19 citations

Electrical Engineering, Semiconductor Device, Engineering +12

Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging

Brian Grummel, Habib A. Mustain, Z. John Shen et al. · 2011 · 17 citations · Full text

Materials Science, Advanced Packaging, Electrical Engineering +14

Rows per page

1–5 of 6