Statistics
Publications
1
Citations
12
H-Index
1
Active since
2010
Affiliations
Shekar Vasarala is an author at Agency for Science, Technology and Research specializing in bumps, flip-chip bonding, and materials science.
Publications per year
2010–2010
1
1
Three chips stacking with low volume solder using single re-flow process
Navas Khan, David Ho Soon Wee, Ong Siong Chiew et al. · 2010 · 12 citations
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