A. Nowodzinski

Nitrogen-Vacancy centers in diamond for current imaging at the redistributive layer level of Integrated Circuits

A. Nowodzinski, Mayeul Chipaux, Loïc Toraille et al. · Microelectronics Reliability · 2015 · 80 citations · Full text

Diamond-like Carbon, Electrical Engineering, Engineering +8

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding

Yann Beilliard, Thomas Signamarcheix, S. Moreau et al. · 2014 · 36 citations

Reliability Study, Engineering, Bonding Quality +17

High total dose irradiation experiments on fiber optic components for fusion reactor environments

Francis Berghmans, Marco Van Uffelen, A. Nowodzinski et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1999 · 17 citations

Detailed Characterisation of Ni Microinsert Technology For Flip Chip Die on Wafer Attachment

A. Mathewson, J.J. Brun, G. Ponthenier et al. · 2007 · 15 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +22

Radiation effects in optical communication devices

Francis Berghmans, Marco Van Uffelen, A. Fernandez Fernandez et al. · 2002 · 14 citations

Optical Materials, Engineering, Optical Transmission System +17