Concepedia

Max O. Bloomfield

MO

12

Publications

327

Citations

11

H-Index

2001

Active since

Affiliations

Rensselaer Polytechnic Institute(Current)

Max O. Bloomfield is an author at Rensselaer Polytechnic Institute specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceNumerical SimulationThermodynamicsMicroelectronicsMultiscale ModelingElectronic PackagingElectrical EngineeringMechanical Engineering

Publications per year

2001–2018

12

Publications

12

Modeling Thermal Stresses in 3-D IC Interwafer Interconnects

Jing Zhang, Max O. Bloomfield, Jian‐Qiang Lu et al. · IEEE Transactions on Semiconductor Manufacturing · 2006 · 72 citations

Engineering, Stress Slope, Mechanical Engineering +24

Thermal stresses in 3D IC inter-wafer interconnects

Jing Zhang, Max O. Bloomfield, Jian-Qiang Lü et al. · Microelectronic Engineering · 2005 · 50 citations

3D Ic Architecture, Electrical Engineering, Engineering +7

Integrated multiscale process simulation

T.S. Cale, Max O. Bloomfield, David F. Richards et al. · Computational Materials Science · 2002 · 32 citations

Engineering, Multiscale Analysis, Process Simulation Model +8

A computational framework for modelling grain-structure evolution in three dimensions

Max O. Bloomfield, David F. Richards, Timothy S. Cale · The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics · 2003 · 28 citations

Modeling Pattern Density Dependent Bump Formation in Copper Electrochemical Deposition

Yeon‐Ho Im, Max O. Bloomfield, Suchira Sen et al. · Electrochemical and Solid-State Letters · 2003 · 26 citations

Materials Engineering, Materials Science, Electromigration Technique +13

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