Publication | Closed Access
Thermal stresses in 3D IC inter-wafer interconnects
50
Citations
24
References
2005
Year
3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsThermal StressesHeat TransferElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)
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