Concepedia

D.C. Burdeaux

DB

Statistics

Publications

6

Citations

222

H-Index

6

Active since

1989

Affiliations

Dow Chemical (United States)(Current)

Auburn University

D.C. Burdeaux is an author at Dow Chemical (United States) specializing in materials science, materials engineering, and thin films.

Publications per year

1989–2011

6

Publications

6

Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules

D.C. Burdeaux, P. H. Townsend, Joseph Carr et al. · Journal of Electronic Materials · 1990 · 137 citations

Natural Sciences, Materials Engineering, Materials Science +14

Benzocyclobutene interlayer dielectrics for thin film multichip modules

Wayne Johnson, T.L. Phillips, W. Ken Weidner et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Intrinsic reliability of RF power LDMOS FETs

D.C. Burdeaux, W. Burger · 2011 · 16 citations

Engineering, Electrical Engineering, Electronic Materials +16

Benzocyclobutene as a dielectric for multichip module fabrication

M. Berry, Ted Tessier, I. Turlik et al. · 2002 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17

Planarization with Cyclotene™ 3022 (BCB) Polymer Coatings

T. M. Stokich, C. C. Fulks, Mark T. Bernius et al. · MRS Proceedings · 1993 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +12

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