J. Lohan

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

Suresh V. Garimella, Yogendra Joshi, Avram Bar‐Cohen et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 77 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +19

A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer

Valérie Eveloy, J. Lohan, Peter Rodgers · IEEE Transactions on Components and Packaging Technologies · 2000 · 51 citations

Numerical Analysis, Engineering, Cfd Tool Need +21

Assessing Good-Practice Frameworks for the Development of Sustainable Energy Communities in Europe: Lessons from Denmark and Ireland

Eimear Heaslip, Gabriel J. Costello, J. Lohan · Journal of Sustainable Development of Energy Water and Environment Systems · 2016 · 44 citations · Full text

Engineering, Sustainability Governance, Sustainable Development +17

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

J. Lohan, P. Tiilikka, Peter Rodgers et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 33 citations

Engineering, Convective Heat Transfer, Thermal Conductivity +20

Comparison of metaheuristic optimisation methods for grid-edge technology that leverages heat pumps and thermal energy storage

Christoph Schellenberg, J. Lohan, Laurentiu Dimache · Renewable and Sustainable Energy Reviews · 2020 · 29 citations · Full text

Ga Optimisation, Engineering, Energy Efficiency +17