Concepedia

P. Tiilikka

PT

Statistics

Publications

4

Citations

99

H-Index

4

Active since

2000

Affiliations

Nokia (Finland)(Current)

Galway-Mayo Institute of Technology

University of Limerick

P. Tiilikka is an author at Nokia (Finland) specializing in electronic packaging, refrigeration, and thermodynamics.

Top concepts

EngineeringHeat TransferRefrigerationThermodynamicsThermal ModelingThermal ManagementThermal EngineeringElectronic PackagingElectrical EngineeringMicroelectronics

Publications per year

2000–2003

4

Publications

4

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

J. Lohan, P. Tiilikka, Peter Rodgers et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 33 citations

Engineering, Convective Heat Transfer, Thermal Conductivity +20

Experimental validation of numerical heat transfer predictions for singleand multi-component printed circuit boards in natural convection environments

Peter Rodgers, Valérie Eveloy, J. Lohan et al. · 2003 · 28 citations

Engineering, Experimental Validation, Liquid Metal Cooling +22

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

J. Lohan, P. Tiilikka, Paul Rodgers et al. · 2002 · 22 citations

Engineering, Mechanical Engineering, Forced Convection +20

Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction

J. Lohan, P. Tiilikka, C.-M. Fager et al. · 2002 · 16 citations

Engineering, Liquid Metal Cooling, Convection Environment +18

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