Concepedia

Keith F. Beckham

KF

4

Publications

57

Citations

4

H-Index

1988

Active since

Affiliations

IBM (United States)(Current)

Keith F. Beckham is an author at IBM (United States) specializing in electronic packaging, electrical engineering, and thermal engineering.

Top concepts

EngineeringHeat TransferMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsThermal EngineeringElectronic PackagingElectrical EngineeringThermodynamics

Publications per year

1988–2002

4

Publications

4

Flip-chip interconnection technology for advanced thermal conduction modules

Sumit Kumar Ray, Keith F. Beckham, R.N. Master · 2002 · 20 citations

Engineering, Integrated Circuits, Flip-chip Interconnection Technology +17

Device interconnection technology for advanced thermal conduction modules

Sumit Kumar Ray, Keith F. Beckham, R.N. Master · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 16 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors

Peter J. Brofman, Sumit Kumar Ray, Keith F. Beckham · IBM Journal of Research and Development · 1992 · 11 citations

Engineering, Laser Deletion Processes, Liquid Metal Cooling +22

Effects of heat treating Au/Ni thin film composites in various ambients

Santosh Kurinec, I. Toor, Y.-K. Chao et al. · Thin Solid Films · 1988 · 10 citations

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