Ji Chul Yang

A 7nm CMOS technology platform for mobile and high performance compute application

B. Jagannathan, Akihisa Ogino, D. Jaeger et al. · 2017 · 58 citations

Engineering, Vlsi Design, Computer Architecture +17

Post Cleaning for FEOL CMP with Silica and Ceria Slurries

Wei‐Tsu Tseng, Changhong Wu, Tim McCormack et al. · ECS Journal of Solid State Science and Technology · 2017 · 54 citations · Full text

Materials Science, Extractive Metallurgy, Chemical Engineering +15

Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish

Ji Chul Yang, Dong Won Oh, Gae Won Lee et al. · Wear · 2009 · 44 citations

Materials Science, Chemical Engineering, Engineering +12

Fabrication and surface characterization of biomimic superhydrophobic copper surface by solution-immersion and self-assembly

Shiheng Yin, Dongxiao Wu, Ji Chul Yang et al. · Applied Surface Science · 2011 · 41 citations

Materials Science, Surface Characterization, Chemical Engineering +5

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Ji Chul Yang, Dong Won Oh, Ho Joong Kim et al. · Journal of Electronic Materials · 2010 · 35 citations

Materials Science, Chemical Engineering, Surface Hardening +9