Adam R. Zbrzezny - Concepedia

Author

Adam R. Zbrzezny

Also Known As

A. R. Zbrzezny, A.R. Zbrzezny, Adam R. Zbrzezny, Adam Robert Zbrzezny, Adam Zbrzezny

Publications

Citations

H-Index

Concepts

All Affiliations

Adam R. Zbrzezny is an author at University of Toronto specializing in electronic packaging, engineering, and materials science.

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	56
2	Materials Science	3	3	44
3	Electrical Engineering	2	2	31
4	Applied Physics	1	1	19
5	Computer Engineering	1	1	12

Adam R. Zbrzezny

Publications

Citations

H-Index

Page 1

	Year	Citations
Reliability Investigation of Mixed BGA Assemblies Adam R. Zbrzezny, Polina Snugovsky, Tanya Lindsay, IEEE Transactions on Electronics Packaging Manufacturing ReliabilityMaterials ScienceElectrical EngineeringReliability EngineeringEngineering	2006	19
Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate Yan Qi, Adam R. Zbrzezny, M. Agia, Journal of Electronic Materials Materials ScienceEngineeringMechanical EngineeringReflow Cooling RateThermomechanical Analysis	2004	14
Reliability of wafer level chip scale packages (WL-CSP) under dynamic loadings Yeong J. Lee, Paul Crosbie, Matt Brown, EngineeringComputer ArchitectureReliability EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2008	12
Impact of board and component metallizations on microstructure and reliability of lead-free solder joints Adam R. Zbrzezny, Polina Snugovsky, Doug D. Perovic Microelectronics Reliability Materials ScienceEngineeringCorrosionMechanical EngineeringMetallurgical Interaction	2007	11

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