Polina Snugovsky - Concepedia

Author

Polina Snugovsky

University of Toronto

Also Known As

P Snugovsky, P. Snugovsky, Polina Snugovsky

Publications

458

Citations

H-Index

Concepts

All Affiliations

University of Toronto BAE Systems (United States)Hewlett-Packard (United States)

About

Polina Snugovsky is an author at University of Toronto specializing in materials science, engineering, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	16	394
2	Applied Physics	6	6	174
3	Chemistry	4	4	78
4	Electrical Engineering	2	2	89
5	Chemical Engineering	1	1	16

Polina Snugovsky

Publications

407

Citations

H-Index

Page 1

	Year	Citations
Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints Polina Snugovsky, P. Arrowsmith, Marianne Romansky Journal of Electronic Materials Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2001	70
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints Yan Qi, Rex Lam, Hamid Reza Ghorbani, Microelectronics Reliability Materials ScienceTemperature Profile EffectsEngineeringMechanical EngineeringPb-free Solder Joints	2005	67
Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder L. Snugovsky, Polina Snugovsky, Doug D. Perovic, Materials Science and Technology Materials EngineeringMaterials ScienceEngineeringPowder MetallurgySurface Science	2005	35
Phase equilibria in Sn rich corner of Cu–Ni–Sn system L. Snugovsky, Polina Snugovsky, Doug D. Perovic, Materials Science and Technology Materials ScienceInorganic ChemistryEngineeringPhase EquilibriumQuasi-peritectic Reactions	2006	27
Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys L. Snugovsky, Polina Snugovsky, Doug D. Perovic, Materials Science and Technology Materials ScienceMaterials EngineeringSn DendritesHigh Temperature MaterialsPb Free Solder	2005	25
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies Polina Snugovsky, Heather McCormick, Simin Bagheri, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2008	21
Whisker Formation on SAC305 Soldered Assemblies Stephan Meschter, Polina Snugovsky, Zohreh Bagheri, JOM Materials ScienceMaterials EngineeringAdvanced PackagingSac305 AssembliesPowder Metallurgy	2014	20
Reliability Investigation of Mixed BGA Assemblies Adam R. Zbrzezny, Polina Snugovsky, Tanya Lindsay, IEEE Transactions on Electronics Packaging Manufacturing ReliabilityMaterials ScienceElectrical EngineeringReliability EngineeringEngineering	2006	19
Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth Joseph M. Juarez, Polina Snugovsky, Eva Kosiba, Journal of Microelectronics and Electronic Packaging Materials ScienceMaterials EngineeringConventional Sac305Lower Melting PointHigh Temperature Materials	2015	19
Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys André M. Delhaise, Polina Snugovsky, Jeff Kennedy, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringCorrosionAlloy Design	2019	17

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