Polina Snugovsky

Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints

Polina Snugovsky, P. Arrowsmith, Marianne Romansky · Journal of Electronic Materials · 2001 · 70 citations

Materials Science, Materials Engineering, Electrical Engineering +12

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

Yan Qi, Rex Lam, Hamid Reza Ghorbani et al. · Microelectronics Reliability · 2005 · 67 citations

Materials Science, Temperature Profile Effects, Engineering +9

Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

L. Snugovsky, Polina Snugovsky, Doug D. Perovic et al. · Materials Science and Technology · 2005 · 35 citations

Materials Engineering, Materials Science, Engineering +13

Phase equilibria in Sn rich corner of Cu–Ni–Sn system

L. Snugovsky, Polina Snugovsky, Doug D. Perovic et al. · Materials Science and Technology · 2006 · 27 citations

Materials Science, Inorganic Chemistry, Engineering +11

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, Polina Snugovsky, Doug D. Perovic et al. · Materials Science and Technology · 2005 · 25 citations

Materials Science, Materials Engineering, Sn Dendrites +13