Publication | Closed Access
Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints
70
Citations
3
References
2001
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)NanoelectronicsSurface ScienceApplied PhysicsWire BondsChip AttachmentSolder JointsElectronic PackagingMicroelectronicsBlack Pad
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