Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints - Concepedia

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Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

67

Citations

12

References

2005

Year

Yan Qi, Rex Lam, Hamid Reza Ghorbani, Polina Snugovsky, J.K. Spelt

Microelectronics Reliability

Materials ScienceTemperature Profile EffectsEngineeringMechanical EngineeringPb-free Solder JointsAccelerated Thermal CyclingThermal AnalysisThermodynamicsElectronic PackagingHeat TransferThermomechanical AnalysisThermal Engineering

References

	Year	Citations

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