Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate - Concepedia

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Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate

14

Citations

3

References

2004

Year

Yan Qi, Adam R. Zbrzezny, M. Agia, Rex Lam, Hamid Ghorbani, Polina Snugovsky, Doug D. Perovic, J.K. Spelt

Journal of Electronic Materials

Materials ScienceEngineeringMechanical EngineeringReflow Cooling RateThermomechanical AnalysisCold WorkingThermal AnalysisThermodynamicsHeat TreatingHeat TransferElectronic PackagingThermal FatigueThermal EngineeringLow-cycle FatigueLead-free Solder Joints

References

	Year	Citations

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