Concepedia

D. Olsen

DO

5

Publications

239

Citations

5

H-Index

1975

Active since

Affiliations

Institute of Materials Research and Engineering(Current)

Motorola (United States)

D. Olsen is an author at Institute of Materials Research and Engineering specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingCorrosionApplied PhysicsMaterials EngineeringMechanical EngineeringChemistryMechanics Of Materials

Publications per year

1975–2002

5

Publications

5

Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages

Ming Li, K.Y. Lee, D. Olsen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 85 citations

Engineering, Pb-free Solders, Solder Ball +19

Properties of Die Bond Alloys Relating to Thermal Fatigue

D. Olsen, H. Berg · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1979 · 65 citations

Engineering, Mechanical Engineering, Hard Solders +16

Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages

Ka Yau Lee, Ming Li, D. Olsen et al. · 2002 · 39 citations

Engineering, Sn-pb-ag Solders, Chemistry +17

Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts

D. Olsen, Richard Wright, H. Berg · Reliability physics · 1975 · 28 citations

Engineering, Mechanical Engineering, Combined Growth Rate +19

Missing solder ball failure mechanisms in plastic ball grid array packages

Chong Zhong, Sung Yi, Y.C. Mui et al. · 2002 · 22 citations

Materials Science, Ball Pad Metallurgy, Engineering +10

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