Concepedia

H. Berg

HB

22

Publications

647

Citations

15

H-Index

1972

Active since

Affiliations

Motorola (United States)(Current)

H. Berg is an author at Motorola (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMicrostructureAdvanced PackagingPlasticityMaterials EngineeringElectrical EngineeringMechanics Of Materials

Publications per year

1972–2002

22

Publications

22

Enhancing Ultrasonic Bond Development

Vern H. Winchell, H. Berg · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1978 · 72 citations

Ultrasonic Bond Development, Engineering, Severe Plastic Deformation +17

Properties of Die Bond Alloys Relating to Thermal Fatigue

D. Olsen, H. Berg · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1979 · 65 citations

Engineering, Mechanical Engineering, Hard Solders +16

Long-range order and ordering kinetics in CoPt3

H. Berg, J. B. Cohen · Metallurgical Transactions · 1972 · 61 citations

Natural Sciences, Kinetics (Physics), Reaction Intermediate +4

"Measurement of Silicon Strength as Affected by Wafer Back Processing"

G. W. Hawkins, H. Berg, Mali Mahalingam et al. · Reliability physics · 1987 · 54 citations

Silicon Strength, Engineering, Measurement +19

Thermal Characteristics of 16- and 40-Pin Plastic DIP's

J. Andrews, L. Mahalingam, H. Berg · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1981 · 48 citations

Engineering, Mechanical Engineering, Refrigeration +17

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