H. Berg - Concepedia

Author

H. Berg

Motorola (United States)

Also Known As

H. Berg, H. M. Berg, H.M. Berg, Howard Berg, Howard M. Berg

Publications

683

Citations

H-Index

Concepts

All Affiliations

Motorola (United States)

About

H. Berg is an author at Motorola (United States) specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	21	586
2	Applied Physics	5	5	167
3	Education	1	1	54
4	Natural Sciences	1	1	61
5	Social Sciences	1	1	10

H. Berg

Publications

647

Citations

H-Index

Page 1

	Year	Citations
Enhancing Ultrasonic Bond Development Vern H. Winchell, H. Berg IEEE Transactions on Components Hybrids and Manufacturing Technology Ultrasonic Bond DevelopmentEngineeringSevere Plastic DeformationMechanical EngineeringBond Development	1978	72
Properties of Die Bond Alloys Relating to Thermal Fatigue D. Olsen, H. Berg IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringMechanical EngineeringHard SoldersHardnessStructural Materials	1979	65
Long-range order and ordering kinetics in CoPt3 H. Berg, J. B. Cohen Metallurgical Transactions Natural SciencesKinetics (Physics)Reaction IntermediateQuantum ChemistryChemistry	1972	61
"Measurement of Silicon Strength as Affected by Wafer Back Processing" G. W. Hawkins, H. Berg, Mali Mahalingam, Reliability physics Silicon StrengthEngineeringMeasurementChip BreaksMechanical Engineering	1987	54
Thermal Characteristics of 16- and 40-Pin Plastic DIP's J. Andrews, L. Mahalingam, H. Berg IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringMechanical EngineeringRefrigerationThermal InsulationHigher Device Powers	1981	48
Model and analyses for solder reflow cracking phenomenon in SMT plastic packages G.S. Ganesan, H. Berg IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringMechanical EngineeringPlastic PackagesSmt Plastic PackagesMolding (Process)	1993	42
Micro-Corrosion of Al-Cu Bonding Pads Simon Thomas, H. Berg IEEE Transactions on Components Hybrids and Manufacturing Technology Materials EngineeringMaterials ScienceAluminum Metallization FilmsCopper AdditionsEngineering	1987	34
Chip corrosion in plastic packages H. Berg, W. M. Paulson Microelectronics Reliability Materials ScienceCorrosion ProtectionEngineeringCorrosionPlasticity	1980	29
Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts D. Olsen, Richard Wright, H. Berg Reliability physics EngineeringMechanical EngineeringCombined Growth RateChemistryCorrosion	1975	28
Thermal performance limits of the QFP family S. Mulgaonker, B. Chambers, M. Mahalingam, IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringEnergy EfficiencyIntegrated CircuitsThermal EnergyRefrigeration	1994	25

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