Concepedia

Daizo Ichikawa

DI

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Publications

3

Citations

40

H-Index

3

Active since

2003

Affiliations

Fuji Machine (Japan)(Current)

Daizo Ichikawa is an author at Fuji Machine (Japan) specializing in materials science, materials engineering, and surface finishing.

Publications per year

2003–2016

3

Publications

3

Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition

Toshiro Doi, Kiyoshi Seshimo, Tsutomu Yamazaki et al. · ECS Journal of Solid State Science and Technology · 2016 · 16 citations · Full text

Engineering, Materials Engineering, Materials Science +11

Modeling Copper CMP Removal Rate Dependency on Wafer Pressure, Velocity, and Dissolved Oxygen Concentration

Darren DeNardis, Toshiro Doi, Brent Hiskey et al. · Journal of The Electrochemical Society · 2006 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +16

Side Chain Effect on Thermochromism and Solvatochromism of End-Grafted Polysilane [Si(CH<sub>3</sub>)<sub>2</sub>SiR<sub>2</sub>]<i><sub>n</sub></i> (R = C<sub>2</sub>H<sub>5</sub>, <i>n</i>-C<sub>4</sub>H<sub>9</sub>, <i>n</i>-C<sub>6</sub>H<sub>13</sub>, <i>n</i>-C<sub>8</sub>H<sub>17</sub>, <i>n</i>-C<sub>10</sub>H<sub>21</sub>)

Kazuaki Furukawa, Keisuke Ebata, Daizo Ichikawa et al. · Macromolecules · 2003 · 10 citations

Natural Sciences, Chemistry, Materials Science +15

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