Concepedia

Kiyoshi Seshimo

KS

Statistics

Publications

4

Citations

73

H-Index

4

Active since

2004

Affiliations

Kyushu University(Current)

Kiyoshi Seshimo is an author at Kyushu University specializing in materials engineering, materials science, and mechanical polishing.

Publications per year

2004–2022

4

Publications

4

Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP

T.K. Doy, Kiyoshi Seshimo, Keisuke Suzuki et al. · Journal of The Electrochemical Society · 2004 · 26 citations · Full text

, , +17

Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water

Hideo Aida, Seong‐Woo Kim, Kenjiro Ikejiri et al. · Precision Engineering · 2014 · 20 citations

, , +10

Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition

Toshiro Doi, Kiyoshi Seshimo, Tsutomu Yamazaki et al. · ECS Journal of Solid State Science and Technology · 2016 · 16 citations · Full text

, , +11

Effect of Mn-Based Slurries on Chemical Mechanical Polishing of SiC Substrates

Panpan Zhao, Tao Yin, Toshiro Doi et al. · ECS Journal of Solid State Science and Technology · 2022 · 11 citations

, , +17

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