D. Degryse

Mechanical FEM Simulation of Bonding Process on Cu Lowk Wafers

D. Degryse, Bart Vandevelde, Eric Beyne · IEEE Transactions on Components and Packaging Technologies · 2004 · 51 citations

Engineering, Mechanical Engineering, Mechanical Fem Simulation +21

Challenges for structural stability of ultra-low-k-based interconnects

Francesca Iacopi, Sywert Brongersma, Bart Vandevelde et al. · Microelectronic Engineering · 2004 · 50 citations

3D Ic Architecture, Engineering, Advanced Packaging (Semiconductors) +6

Mechanical Issues of Cu-to-Cu Wire Bonding

J. Chen, D. Degryse, Petar Ratchev · IEEE Transactions on Components and Packaging Technologies · 2004 · 46 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +18

Modified micro–macro thermo-mechanical modelling of ceramic ball grid array packages

Bart Vandevelde, D. Degryse, Eric Beyne et al. · Microelectronics Reliability · 2003 · 23 citations

Materials Science, Engineering, Ceramic Material +9

FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing

D. Degryse, Bart Vandevelde, Eric Beyne · 2004 · 14 citations

Engineering, Copper Low-k Structures, Severe Plastic Deformation +23