Caroline Whelan is an author at IMEC specializing in electronic packaging, materials engineering, and surface science.
Top concepts
EngineeringApplied PhysicsSurface ScienceMaterial ScienceChemical EngineeringElectronic PackagingMaterials EngineeringThin FilmsMicroelectronicsMicrofabrication
Publications per year
1998–2003
2
2
Direct Au and Cu wire bonding on Cu/low-k BEOL
P. Banda, Hong Meng Ho, Caroline Whelan et al. · 2003 · 12 citations
Materials Engineering, Materials Science, Chemical Engineering +15
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