Kaustubh S. Gadre

Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

Arief Suriadi Budiman, William D. Nix, Nobumichi Tamura et al. · Applied Physics Letters · 2006 · 101 citations

Point Defects, Engineering, Severe Plastic Deformation +19

Stability of silver thin films on various underlying layers at elevated temperatures

T.L. Alford, Linghui Chen, Kaustubh S. Gadre · Thin Solid Films · 2003 · 94 citations

Materials Science, Elevated Temperatures, Engineering +7

Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-<i>n</i> and SiO2 substrates

Kaustubh S. Gadre, T. L. Alford · Journal of Applied Physics · 2003 · 60 citations

Engineering, Adhesion Energies, Contact Angle Measurements +17

Crack formation in TiN films deposited on Pa-n due to large thermal mismatch

Kaustubh S. Gadre · Thin Solid Films · 2001 · 21 citations

Materials Science, Materials Engineering, Tin Films +8

Investigation of thermal stability, phase formation, electrical, and microstructural properties of sputter-deposited titanium aluminide thin films

H.C. Kim, N. David Theodore, Kaustubh S. Gadre et al. · Thin Solid Films · 2004 · 21 citations

Materials Science, Engineering, Applied Physics +8