Concepedia

Maria Lykova

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Publications

3

Citations

42

H-Index

3

Active since

2018

Affiliations

Technische Universität Dresden(Current)

Chemnitz University of Technology

Fraunhofer Institute for Reliability and Microintegration

Fraunhofer Institute for Electronic Nano Systems

Maria Lykova is an author at Technische Universität Dresden specializing in materials science, materials engineering, and natural sciences.

Publications per year

2018–2023

3

Publications

3

Characterisation of Cu/Cu bonding using self-assembled monolayer

Maria Lykova, Iuliana Panchenko, U. Künzelmann et al. · Soldering and Surface Mount Technology · 2018 · 15 citations

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Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding

Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · 2023 · 14 citations

, , +17

Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration

Maria Lykova, Iuliana Panchenko, Martin Schneider‐Ramelow et al. · Micromachines · 2023 · 13 citations · Full text

, , +15

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