Rémy Charavel

Next generation of Deep Trench Isolation for Smart Power technologies with 120V high-voltage devices

Rémy Charavel, J. Roig, S. Mouhoubi et al. · Microelectronics Reliability · 2010 · 17 citations

Engineering, Electrical Engineering, Microelectronics +6

Etch Rate Modification of SiO[sub 2] by Ion Damage

Rémy Charavel, Jean‐Pierre Raskin · Electrochemical and Solid-State Letters · 2006 · 16 citations

Engineering, Materials Engineering, Materials Science +15

Assessment of MgO(100) and (111) substrate quality by X-ray diffraction

Lynnette D. Madsen, Rémy Charavel, Jens Birch et al. · Journal of Crystal Growth · 2000 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +11

Tuning of Etching Rate by Implantation: Silicon, Polysilicon and Oxide

Rémy Charavel, Jean‐Pierre Raskin · AIP conference proceedings · 2006 · 11 citations

Engineering, Materials Engineering, Materials Science +17

Stress release of PECVD oxide by RTA

Rémy Charavel, Benoît Olbrechts, Jean‐Pierre Raskin · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2003 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17