Dierk Kaller

Signal Integrity Verification of Multichip Links Using Passive Channel Macromodels

Alessandro Chinea, S. Grivet‐Talocia, Haisheng Hu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 22 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Electronic packaging of the IBM z13 processor drawer

Dale Becker, H. Harrer, Andreas Huber et al. · IBM Journal of Research and Development · 2015 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

First- and second-level packaging of the z990 processor cage

T.-M. Winkel, Dale Becker, H. Harrer et al. · IBM Journal of Research and Development · 2004 · 20 citations

Engineering, Computer Engineering, Computer Science +17

Crosstalk analysis in high density connector via pin fields for digital backplane applications using a 12-port vector network analyzer

Miroslav Kotzev, R. Frech, H. Harrer et al. · 2010 · 13 citations

Engineering, Computer Engineering, Electrical Engineering +15

Using s-parameters successfully in time domain link simulations

Dierk Kaller, Christian Schuster, Young Kwark et al. · 2006 · 10 citations

Engineering, Electrical Engineering, Circuit Theory +13