A.Y.S. Sun

Thermal characterization of a thermally enhanced QFN package

S. Krishnamoorthi, Khim Yong Goh, Desmond Y. R. Chong et al. · 2004 · 19 citations

Engineering, Thermal Conductivity, Thermal Analysis +18

Development of a new improved high performance flip chip BGA package

Desmond Y. R. Chong, Byeong-Ok Lim, Kenneth June Rebibis et al. · 2004 · 18 citations

Flip Chip, 3D Ic Architecture, Electrical Engineering +10

Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis

Desmond Y. R. Chong, Rahul Kapoor, A.Y.S. Sun · 2004 · 17 citations

Flip Chip Technology, Engineering, Reliability Assessment +21

Thermal management and characterization of flip chip BGA packages

S. Krishnamoorthi, Desmond Y. R. Chong, A.Y.S. Sun · 2005 · 15 citations

Flip Chip, 3D Ic Architecture, Electrical Engineering +15

Development of Ball Grid Array Packages with Improved Thermal Performance

Yiyi Ma, Desmond Y. R. Chong, C.K. Wang et al. · 2006 · 13 citations

Electrical Engineering, Chip-scale Package, Engineering +15