Concepedia

M. Bründel

MB

3

Publications

57

Citations

3

H-Index

2010

Active since

Affiliations

Robert Bosch (Germany)(Current)

Technische Universität Berlin

Robert Bosch (Taiwan)

Fraunhofer Institute for Reliability and Microintegration

M. Bründel is an author at Robert Bosch (Germany) specializing in advanced packaging, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsElectronic PackagingBiomedical EngineeringBiosensingMicrofluidicsBioelectronics

Publications per year

2010–2013

3

Publications

3

Large area embedding for heterogeneous system integration

Tanja Braun, K.-F. Becker, L. Böttcher et al. · 2010 · 25 citations

Large Area, Cluster Computing, Transfer Molding +23

Through mold via technology for multi-sensor stacking

Tanja Braun, M. Bründel, K.-F. Becker et al. · 2012 · 21 citations

Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integration

Thomas Brettschneider, Christian Dorrer, M. Bründel et al. · Journal of Micromechanics and Microengineering · 2013 · 11 citations

Engineering, Device Integration, Wafer-level Packaging +30

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