Divya Prasad

Buried Power Rails and Back-side Power Grids: Arm^® CPU Power Delivery Network Design Beyond 5nm

Divya Prasad, S. S. Teja Nibhanupudi, Shidhartha Das et al. · 2019 · 63 citations

Engineering, Vlsi Design, Energy Efficiency +18

Adapting Interconnect Technology to Multigate Transistors for Optimum Performance

Divya Prasad, Ahmet Ceyhan, Chenyun Pan et al. · IEEE Transactions on Electron Devices · 2015 · 24 citations

Electrical Engineering, Physical Design (Electronics), Engineering +13

A 64-Bit Arm CPU at Cryogenic temperatures: Design Technology Co-Optimization for Power and Performance

Rakshith Saligram, Divya Prasad, David Pietromonaco et al. · 2021 · 23 citations

Engineering, Vlsi Design, Cryogenic Temperatures +24

A Holistic Evaluation of Buried Power Rails and Back-Side Power for Sub-5 nm Technology Nodes

S. S. Teja Nibhanupudi, Divya Prasad, Shidhartha Das et al. · IEEE Transactions on Electron Devices · 2022 · 18 citations

Engineering, Vlsi Design, Energy Efficiency +24

A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process

Siddhartha Sinha, S. C. H. Hung, Daniel Fisher et al. · 2020 · 14 citations

Engineering, Vlsi Design, Finfet Process +23