Torleif A. Tollefsen

Au-Sn SLID Bonding—Properties and Possibilities

Torleif A. Tollefsen, Andreas Larsson, Ole Martin Løvvik et al. · Metallurgical and Materials Transactions B · 2011 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +9

High Temperature Interconnect and Die Attach Technology: Au–Sn SLID Bonding

Torleif A. Tollefsen, Andreas Larsson, Ole Martin Løvvik et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 52 citations

Engineering, Materials Engineering, Materials Science +17

Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology

Torleif A. Tollefsen, Andreas Larsson, Maaike M. Visser Taklo et al. · Metallurgical and Materials Transactions B · 2013 · 41 citations

Engineering, Materials Engineering, Materials Science +13

Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond

Torleif A. Tollefsen, Ole Martin Løvvik, Knut E. Aasmundtveit et al. · Metallurgical and Materials Transactions A · 2013 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +12

High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In

Knut E. Aasmundtveit, Thi‐Thuy Luu, Astrid-Sofie B. Vardøy et al. · 2014 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +17