Concepedia

Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology

Torleif A. Tollefsen, Andreas Larsson, Maaike M. Visser Taklo, A. Neels, Xavier Maeder, Kristin Høydalsvik, Dag W. Breiby, Knut E. Aasmundtveit

Metallurgical and Materials Transactions B · 2013 · 41 citations · 36 references

DOI

Concepts

References

36

Status and prospects for SiC power MOSFETs

James A. Cooper, M. R. Melloch, Ranbir Singh et al. · IEEE Transactions on Electron Devices · 2002 · 498 citations

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Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

, , +17

Transient Liquid Phase Bonding

W. D. MacDonald, Thomas W. Eagar · Annual Review of Materials Science · 1992 · 306 citations

, , +10

Wide bandgap semiconductor materials and devices

Max N. Yoder · IEEE Transactions on Electron Devices · 1996 · 273 citations

, , +12

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

, , +13