Publication | Closed Access
Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology
41
Citations
36
References
2013
Year
Materials EngineeringMaterials ScienceAu-sn Slid BondingEngineeringAdvanced Packaging (Semiconductors)NanoelectronicsChip On BoardApplied PhysicsChip AttachmentDie Attach TechnologyElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Reliable Ht Interconnect
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