Concepedia

T.T. Lee

TL

Statistics

Publications

3

Citations

166

H-Index

3

Active since

2001

Affiliations

Motorola (United States)(Current)

T.T. Lee is an author at Motorola (United States) specializing in semiconductor reliability, semiconductor devices, and integrated circuit design.

Publications per year

2001–2004

3

Publications

3

Failure mechanism study of anisotropic conductive film (ACF) packages

L.L. Mercado, J. White, V. Sarihan et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 82 citations

, , +17

Analysis of flip-chip packaging challenges on copper low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Koo et al. · 2004 · 49 citations

, , +17

A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package

S. Shidore, V. Adams, T.T. Lee · IEEE Transactions on Components and Packaging Technologies · 2001 · 35 citations

, , +17

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