John Garant

Design and performance of a novel building integrated PV/thermal system for energy efficiency of buildings

Huiming Yin, Daiqin Yang, George Kelly et al. · Solar Energy · 2012 · 131 citations

Architecture, Architectural Engineering, Building Science +16

Face to Face Hybrid Wafer Bonding for Fine Pitch Applications

Daniel Fisher, Sarah H. Knickerbocker, Daniel M. Smith et al. · 2020 · 38 citations

Engineering, Manufacturing Engineering, Electronic Materials +12

C4NP technology: Manufacturability, yields and reliability

E Perfecto, David Hawken, Hai P. Longworth et al. · 2008 · 22 citations

Engineering, Manufacturing Engineering, Materials Engineering +17

50μm pitch Pb-free micro-bumps by C4NP technology

Bing Dang, Da‐Yuan Shih, Stephen L. Buchwalter et al. · 2008 · 20 citations

Engineering, Manufacturing Engineering, Materials Science +13

A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process

Siddhartha Sinha, S. C. H. Hung, Daniel Fisher et al. · 2020 · 14 citations

Engineering, Computer Engineering, Computer-aided Design +14