Michael W. Putty

Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

D. Sparks, G Queen, Rachel Weston et al. · Journal of Micromechanics and Microengineering · 2001 · 110 citations

Engineering, Mechanical Engineering, Cavity Pressure +18

Process Integration for active polysilicon resonant microstructures

Michael W. Putty, Shih−Chia Chang, Roger T. Howe et al. · Sensors and Actuators · 1989 · 53 citations · Full text

Materials Science, Process Integration, Engineering +5

One-port active polysilicon resonant microstructures

Michael W. Putty, S. C. Chang, Roger T. Howe et al. · 2003 · 45 citations

Materials Science, Electrical Engineering, Engineering +10

An electroformed CMOS integrated angular rate sensor

Shinan Chang, M. Chia, P. Castillo-Borelley et al. · Sensors and Actuators A Physical · 1998 · 32 citations

Electrical Engineering, Electroformed Cmos, Engineering +6