D. Sparks

Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

D. Sparks, G Queen, Rachel Weston et al. · Journal of Micromechanics and Microengineering · 2001 · 110 citations

Engineering, Mechanical Engineering, Cavity Pressure +18

Measurement of density and chemical concentration using a microfluidic chip

D. Sparks, R. Smith, M. Straayer et al. · Lab on a Chip · 2003 · 60 citations

Sample Fluid, Engineering, Microfabrication +14

Dynamic and kinematic viscosity measurements with a resonating microtube

D. Sparks, R. Smith, Vincent Cruz et al. · Sensors and Actuators A Physical · 2008 · 46 citations

Engineering, Microfabrication, Fluid Mechanics +6

An electroformed CMOS integrated angular rate sensor

Shinan Chang, M. Chia, P. Castillo-Borelley et al. · Sensors and Actuators A Physical · 1998 · 32 citations

Electrical Engineering, Electroformed Cmos, Engineering +6

A variable temperature, resonant density sensor made using an improved chip-level vacuum package

D. Sparks, R. Smith, R. Schneider et al. · Sensors and Actuators A Physical · 2003 · 31 citations

Sensor Technology, Electrical Engineering, Engineering +11