Haksun Lee

Statistics

Publications

Citations

141

H-Index

Active since

2014

Affiliations

Electronics and Telecommunications Research Institute(Current)

Georgia Institute of Technology

Haksun Lee is an author at Electronics and Telecommunications Research Institute specializing in electronic packaging, engineering, and microfabrication.

ORCID

Top concepts

EngineeringElectronic PackagingMaterial ScienceMicroelectronicsMicrofabricationAdvanced PackagingMaterials EngineeringElectrical EngineeringMechanical Engineering3D Printing

Publications per year

2014–2021

Publications

Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature

Jiaxiong Li, Chao Ren, Zhijian Sun et al. · ACS Applied Materials & Interfaces · 2021 · 46 citations

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Yong‐Sung Eom, Jihye Son, Keon‐Soo Jang et al. · ETRI Journal · 2014 · 39 citations · Full text

Engineering, Fuel Science, Long Pot Life +16

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Haksun Lee, Yong‐Sung Eom, Hyun‐Cheol Bae et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 16 citations

Materials Science, Engineering, Industrial Engineering +14

Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density

Ryan Wong, Siddharth Ravichandran, Haksun Lee et al. · 2020 · 16 citations

Engineering, Energy Efficiency, Integrated Circuits +22

Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

Haksun Lee, Kwang‐Seong Choi, Yong‐Sung Eom et al. · ETRI Journal · 2016 · 14 citations · Full text

Engineering, Mechanical Engineering, Solder Bump Maker +16

1–5 of 6