Ryan Wong

Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

Zhijian Sun, Ryan Wong, Michael Yu et al. · Chemical Engineering Journal · 2022 · 69 citations

Materials Science, Polydopamine-graphene Fillers, Chemical Engineering +9

Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials

Zhijian Sun, Yifan Liu, Ryan Wong et al. · Chemical Engineering Journal · 2022 · 28 citations

Materials Science, Graphene Nanomeshes, Chemical Engineering +12

Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density

Ryan Wong, Siddharth Ravichandran, Haksun Lee et al. · 2020 · 16 citations

Engineering, Energy Efficiency, Integrated Circuits +22

Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

Zhijian Sun, Yifan Liu, Ryan Wong et al. · Composites Science and Technology · 2022 · 13 citations

Materials Science, Graphene Nanomeshes, Chemical Engineering +7

A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging

Zhijian Sun, Ryan Wong, Yifan Liu et al. · Composites Science and Technology · 2022 · 13 citations

Materials Science, Graphene Nanomeshes, Graphene Quantum Dot +11