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A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging

Materials ScienceGraphene NanomeshesGraphene Quantum DotEngineeringNanomaterialsNanoelectronicsEpoxy PolymersThermal Interface ConnectionApplied PhysicsGraphene FiberSilver-graphene FillersGrapheneGraphene NanoribbonElectronic Packaging