Naoki Torazawa

Transmission Electron Microscopy of Interfaces in Joints between Pb-Free Solders and Electroless Ni-P

Naoki Torazawa, Shigeo Arai, Yoshihisa Takase et al. · MATERIALS TRANSACTIONS · 2003 · 20 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Extremely Low Keff (1.9) Cu Interconnects with Air Gap Formed Using SiOC

Takeshi Harada, Akira Ueki, Kazuo Tomita et al. · 2007 · 15 citations

Engineering, Electrical Engineering, Materials Science +16

The Development of Cu Filling and Reliability Performance with Ru-Ta Alloy Barrier for Cu Interconnects

Naoki Torazawa, Shuji Hirao, Shutetsu Kanayama et al. · Journal of The Electrochemical Society · 2016 · 15 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Effects of Ru-Ta Alloy Barrier on Cu Filling and Reliability for Cu Interconnects

Kenichi Mori, Kazuyuki Ohmori, Naoki Torazawa et al. · 2008 · 10 citations

Engineering, Materials Engineering, Materials Science +16

Transmission Electron Microscopy of Solder Joints of Sn-Ag-Cu/Electroless Ni-P and Sn-Ag-Cu-Bi/Electroless Ni-P of an Electronic Device

Naoki Torazawa, Shigeo Arai, Yoshihisa Takase et al. · Journal of the Japan Institute of Metals and Materials · 2002 · 10 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16