3
Publications
247
Citations
3
H-Index
2008
Active since
Affiliations
The University of Texas at Austin(Current)
Wei-Lun Jen is an author at The University of Texas at Austin specializing in engineering, electronic packaging, and flexible electronics.
Top concepts
Engineering3D PrintingNanotechnologyApplied PhysicsNanofabricationNanolithographyMaterial ScienceMicroelectronicsMicrofabricationAdvanced Packaging
Publications per year
2008–2019
3
3
Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
Ravi Mahajan, Zhiguo Qian, Ram Viswanath et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 88 citations
Advanced Packaging, 3D Ic Architecture, Electrical Engineering +12
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