Ram Viswanath is an author at Intel (United States) specializing in electronic packaging, computer engineering, and computer architecture.
Top concepts
EngineeringComputer EngineeringElectronic PackagingComputer ArchitectureElectrical EngineeringMicroelectronicsHeat TransferRefrigerationSystem On ChipThermodynamics
Publications per year
1997–2019
3
3
Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
Ravi Mahajan, Zhiguo Qian, Ram Viswanath et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 88 citations
Advanced Packaging, 3D Ic Architecture, Electrical Engineering +12
Heterogeneous SoC Integration with EMIB
Ram Viswanath, Arun G. Chandrasekhar, Sriram Srinivasan et al. · 2018 · 23 citations
Rows per page
1–3 of 3