Shun-Tien Lin is an author at Ohio Aerospace Institute specializing in electronic packaging, materials science, and materials engineering.
Top concepts
EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringAgingMedicineLongevityHeat TransferMicroelectronicsMicrofabrication
Publications per year
1997–2003
3
3
Die surface stress variation during thermal cycling and thermal aging reliability tests
Yida Zou, Jeffrey C. Suhling, R.C. Jaeger et al. · 2003 · 31 citations
Material System for Packaging 500°C SiC Microsystems
Liang-Yü Chen, Robert S. Okojie, Philip G. Neudeck et al. · MRS Proceedings · 2001 · 12 citations
Materials Science, Materials Engineering, Advanced Packaging +4
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