Yida Zou

In-situ stress state measurements during chip-on-board assembly

Yida Zou, Jeffrey C. Suhling, Wayne Johnson et al. · IEEE Transactions on Electronics Packaging Manufacturing · 1999 · 61 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Die surface stress variation during thermal cycling and thermal aging reliability tests

Yida Zou, Jeffrey C. Suhling, R.C. Jaeger et al. · 2003 · 31 citations

Engineering, Aging, Mechanical Engineering +26

Three dimensional die surface stress measurements in delaminated and non-delaminated plastic packages

Yida Zou, Jeffrey C. Suhling, R.C. Jaeger et al. · 2002 · 27 citations

Engineering, Encapsulation Process, Mechanical Engineering +20

Test chips for die stress characterization using arrays of CMOS sensors

Arthur Bradley, R.C. Jaeger, Jeffrey C. Suhling et al. · 2003 · 18 citations

Engineering, Mechanical Engineering, Die Stress Characterization +19

FET mobility degradation and device mismatch due to packaging induced die stress

R.C. Jaeger, Arthur Bradley, Jeffrey C. Suhling et al. · European Solid-State Circuits Conference · 1997 · 14 citations

Engineering, Cmos Fets, Transistor Location +18