Kuo‐Chung Yee

300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

Wei‐Chih Lai, Harry Chuang, Chung-Hao Tsai et al. · 2013 · 27 citations

Materials Science, Transmission Lines, Electrical Engineering +15

High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling

S. W. Liang, Gene Wu, Kuo‐Chung Yee et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 25 citations

Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch

Han-Jong Chia, Shih-Peng Tai, Ji James Cui et al. · 2023 · 23 citations

Engineering, Vlsi Design, Computer Architecture +18

High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL

Che‐Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh et al. · 2017 · 21 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +14

High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology

Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin et al. · 2015 · 19 citations

Engineering, Radio Frequency, Device Integration +17