Kuo‐Chung Yee - Concepedia

Author

Kuo‐Chung Yee

Taiwan Semiconductor Manufacturing Company (Taiwan)

Also Known As

K C Yee, K. C. Yee, K.C. Yee, Kuo-Chung Yee, Kuo‐Chung Yee

Publications

211

Citations

H-Index

Concepts

All Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)

About

Kuo‐Chung Yee is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in electrical engineering, microelectronics, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	117
2	Electrical Engineering	6	6	117
3	Computer Engineering	4	4	71
4	Applied Physics	1	1	23
5	Materials Engineering	1	1	23

Kuo‐Chung Yee

Publications

165

Citations

H-Index

Page 1

	Year	Citations
300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application Wei‐Chih Lai, Harry Chuang, Chung-Hao Tsai, Materials ScienceTransmission LinesElectrical EngineeringAdvanced PackagingEngineering	2013	27
High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling S. W. Liang, Gene Wu, Kuo‐Chung Yee, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)	2022	25
Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch Han-Jong Chia, Shih-Peng Tai, Ji James Cui, EngineeringVlsi DesignComputer ArchitecturePhysical Design (Electronics)Advanced Packaging (Semiconductors)	2023	23
High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL Che‐Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh, Electrical EngineeringMillimeter Wave TechnologyEngineeringAdvanced Packaging (Semiconductors)Radio Frequency	2017	21
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, EngineeringRadio FrequencyDevice IntegrationInterconnect (Integrated Circuits)Electromagnetic Compatibility	2015	19
3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution Wenxin Liao, H. N. Chen, Kyle Yen, EngineeringVlsi DesignRadio FrequencyMem TestingProprietary Cowos Structure	2013	14
3D-MiM (MUST-in-MUST) Technology for Advanced System Integration An-Jhih Su, Terry Ku, Chung-Hao Tsai, EngineeringDevice IntegrationComputer ArchitectureIntegrated CircuitsSystem Integration	2019	13
A Study of Low Temperature SoIC Targeting 200 nm Bond Pitch Wei-Ming Wang, Chun-Yi Yeh, Han-Jong Chia,	2024	12
SoIC_H Technology for Heterogeneous System Integration Douglas Yu, Chuei-Tang Wang, C. S. Lin, IEEE Transactions on Electron Devices	2022	11

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