Qiwei Ren

A highly CMOS compatible hafnia-based ferroelectric diode

Qing Luo, Yan Cheng, Jianguo Yang et al. · Nature Communications · 2020 · 289 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

184QPS/W 64Mb/mm²3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System

Dimin Niu, Shuangchen Li, Yuhao Wang et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 64 citations

Engineering, Computer Science, Computer Systems +12

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Fujun Bai, Song Wang, Bing Yu et al. · 2020 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV

Song Wang, Bing Yu, Wenwu Xiao et al. · 2023 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 1596-GB/s 48-Gb Stacked Embedded DRAM 384-Core SoC With Hybrid Bonding Integration

Xiping Jiang, Fengguo Zuo, Song Wang et al. · IEEE Solid-State Circuits Letters · 2022 · 12 citations

Engineering, Computer Engineering, Computer Science +9