Ramana Murthy

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Jae Woong Choi, Ong Lee Guan, Yingjun Mao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 38 citations

Engineering, Electrical Engineering, Materials Engineering +16

Enhanced microfiltration devices configured with hydrodynamic trapping and a rain drop bypass filtering architecture for microbial cells detection

Lay Christophe, Cheng Yong Teo, Liang Zhu et al. · Lab on a Chip · 2008 · 31 citations

Engineering, Bioengineering, Microbiology +16

Identifying critical variables for coastal profiling in ICZM planning—A systems approach

Koshy Varghese, L.S. Ganesh, M. Mani et al. · Ocean & Coastal Management · 2007 · 21 citations

Planning, Civil Engineering, Infrastructure Planning +16

Polysilicon interconnections (FEOL): Fabrication and characterization

Ajay Agarwal, Ramana Murthy, Vincent Lee et al. · 2009 · 13 citations

Engineering, Computer Engineering, Electrical Engineering +17

Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect

T.C. Chai, Xiaowu Zhang, H.Y. Li et al. · 2008 · 13 citations

Engineering, Computer Engineering, Materials Science +17