S.N. Burchett

Statistics

Publications

Citations

233

H-Index

Active since

1997

Affiliations

Sandia National Laboratories(Current)

S.N. Burchett is an author at Sandia National Laboratories specializing in materials engineering, thermal stresses, and mechanical behavior of materials.

Publications per year

1997–2003

Publications

Stresses during thermoset cure

Douglas Adolf, James E. Martin, Robert S. Chambers et al. · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 100 citations

Natural Sciences, Materials Engineering, Heat Transfer +10

Microstructurally Based Finite Element Simulationon Solder Joint Behaviour*

D. R. Frear, S.N. Burchett, Michael K. Neilsen et al. · Soldering and Surface Mount Technology · 1997 · 60 citations

Natural Sciences, Materials Engineering, Materials Science +17

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Paul T. Vianco, S.N. Burchett, M. K. Neilsen et al. · Journal of Electronic Materials · 1999 · 40 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle

D.W. Peterson, S.N. Burchett, R.T. Mitchell et al. · 2003 · 33 citations · Full text

Engineering, Materials Engineering, Materials Science +17

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